Micro joining technology - メーカー・企業と製品の一覧 | イプロス

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Mitsui Electronics Co., Ltd. Business Introduction

We handle OEM production of finished products from substrates, LCD modules, and production equipment.

We handle OEM production of finished products from substrates, LCD modules, and production equipment, as well as micro-joining technology for electronic components, and component mounting and connection using ACF and other methods. Mie Electronics is expanding its business scope based on its long experience in the assembly of electronic products, including the mounting of chip components onto substrates, the design and manufacturing of LCD displays, and the design and manufacturing of mechatronics. Additionally, in the electronics field, where miniaturization, weighing, and mobility are advancing, we focus on "joining technologies" such as microfabrication, micro-joining technology, and high-density mounting technology. For more details, please download the catalog.

  • Parts and Materials
  • Micro joining technology

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